MT USED TECHNOLOGY
Board type - Single-sided, Double-sided, Multilayer, Flex, Rigid-Flex, Teflon, High Frequency, MetalCore
Basic material- FR4, FR4 Halogen free, CEM1, CEM3-Termal, Rogers, Taconic, PTFE, Arlon, Nelco, Polyimide
Number of conductive layers - Up to 26
Maximal working panel ( brutto ) - 457 x 610 mm (535 x 610 mm)
Total board thickness - {0,2mm – 5,0mm}
Inner layer thickness - {0,05mm – 3,2mm}
Minimal line width, space - 70 µm ( 50 µm )
Copper foil thickness on outer layers - 18 µm, 35 µm, 70 µm, 105 µm, 140 µm , 170 µm 210 µm, 400 µm
Copper foil thickness on inner layers -18 µm, 35 µm, 70 µm, 105 µm, 140 µm
Drilling diameters: 0,1 mm – 6,4 mm
CNC drilling
working format: max. 750 mm x 650 mm
drilling tolerance (hole to hole): +/- 0,05 mm
drilling through holes (THT): diameter min. 0,1 mm, max. 6,4 mm
drilling blind vias: diameter min. 0,125 mm, depth accuracy +/- 0,025 mm
drilling burried vias on inner layers: diameter min. 0,1 mm, max. 6,4 mm
ML lamination
working format: max. 650 mm x 550 mm
inner layer bonding
inner layer thickness: min. 0,05 mm
inner layer isolation: min. 0,058 mm
composite thickness after lamination: min. 0,3 mm, max. 5,0 mm
Automated optical inspection (AOI)
inspection of inner and outer layers in the ML boards production
line spacing: min. 25 µm line/space
Copper electroplating
DOW chemical copper
Atotech TLC electrolytic copper
Final surface finishes
ENIG deposit thickness: Au: min. 0,05 µm, Ni: min. 3,0 µm
hard gold selective deposit, contact: Au deposit thickness: min. 0,2 µm (hard gold, alloyed with cobalt)
Sn/Pb selective deposit (HAL with lead)
Sn selective deposit (HAL lead-free)
chemical tin process: Sn deposit thickness: 0,6 – 1,2 µm
chemical nickel process
OSP (Organic Surface Protection)
chemical silver: Ag deposit thickness: 0,2 – 0,4 µm
Note: Surface finish can be applied only on PCBs.
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